bsc079n10ns g opti mos ?2 power-transistor features ? n-channel, normal level ? excellent gate charge x r ds(on) product (fom) ? very low on-resistance r ds(on) ? 150 c operating temperature ? pb-free lead plating; rohs compliant ? qualified according to jedec 1) for target application ? ideal for high-frequency switching and synchronous rectification ? halogen-free according to iec61249-2-21 maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t c =25 c 100 a t c =100 c 64 t a =25 c, r thja =45 k/w 2) 13.4 pulsed drain current 3) i d,pulse t c =25 c 400 avalanche energy, single pulse e as i d =50 a, r gs =25 ? 377 mj gate source voltage v gs 20 v power dissipation p tot t c =25 c 156 w operating and storage temperature t j , t stg -55 ... 150 c iec climatic category; din iec 68-1 55/150/56 value 1) j-std20 and jesd22 v ds 100 v r ds(on),max 7.9 m ? i d 100 a product summary type package marking bsc079n10ns g pg-tdson-8 079n10ns pg-tdson-8 rev. 1.05 page 1 2009-11-03
bsc079n10ns g parameter symbol conditions unit min. typ. max. thermal characteristics thermal resistance, junction - case r thjc bottom - - 0.8 k/w top - - 18 r thja minimal footprint - - 62 6 cm 2 cooling area 2) --45 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0 v, i d =1 ma 100 - - v gate threshold voltage v gs(th) v ds = v gs , i d =110 a 234 zero gate voltage drain current i dss v ds =100 v, v gs =0 v, t j =25 c - 0.01 1 a v ds =100 v, v gs =0 v, t j =125 c - 10 100 gate-source leakage current i gss v gs =20 v, v ds =0 v - 1 100 na drain-source on-state resistance r ds(on) v gs =10 v, i d =50 a - 6.6 7.9 m ? gate resistance r g -1- ? transconductance g fs | v ds |>2| i d | r ds(on)max , i d =50 a 40 80 - s values 2) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. thermal resistance, junction - ambient 3) see figure 3 rev. 1.05 page 2 2009-11-03
bsc079n10ns g parameter symbol conditions unit min. typ. max. dynamic characteristics input capacitance c iss - 4400 5900 pf output capacitance c oss - 660 880 reverse transfer capacitance c rss -3857 turn-on delay time t d(on) -2436ns rise time t r -4060 turn-off delay time t d(off) -3857 fall time t f -1117 gate char g e characteristics 4) gate to source charge q gs -2229nc gate to drain charge q gd -1523 switching charge q sw -3043 gate charge total q g -6687 gate plateau voltage v plateau - 5.1 - v output charge q oss v dd =50 v, v gs =0 v -7092nc reverse diode diode continous forward current i s - - 100 a diode pulse current i s,pulse - - 400 diode forward voltage v sd v gs =0 v, i f =50 a, t j =25 c - 0.9 1.2 v reverse recovery time t rr - 107 ns reverse recovery charge q rr - 231 nc 4) see figure 16 for gate charge parameter definition v r =15 v, i f =50 a, d i f /d t =400 a/s t c =25 c values v gs =0 v, v ds =50 v, f =1 mhz v dd =50 v, v gs =10 v, i d =50 a, r g =1.6 ? v dd =50 v, i d =50 a, v gs =0 to 10 v rev. 1.05 page 3 2009-11-03
bsc079n10ns g 1 power dissipation 2 drain current p tot =f( t c ) i d =f( t c ); v gs 10 v 3 safe operating area 4 max. transient thermal impedance i d =f( v ds ); t c =25 c; d =0 z thjc =f( t p ) parameter: t p parameter: d = t p / t single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 0 10 -1 10 -2 t p [s] z thjc [k/w] 0 40 80 120 160 0 40 80 120 160 t c [c] p tot [w] 0 20 40 60 80 100 120 0 40 80 120 160 t c [c] i d [a] 1 s 10 s 100 s 1 ms 10 ms dc 10 3 10 2 10 1 10 0 10 -1 10 3 10 2 10 1 10 0 10 -1 v ds [v] i d [a] rev. 1.05 page 4 2009-11-03
bsc079n10ns g 5 typ. output characteristics 6 typ. drain-source on resistance i d =f( v ds ); t j =25 c r ds(on) =f( i d ); t j =25 c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. forward transconductance i d =f( v gs ); | v ds |>2| i d | r ds(on)max g fs =f( i d ); t j =25 c parameter: t j 4.5 v 5 v 5.5 v 6 v 7 v 10 v 0 5 10 15 20 0 50 100 150 i d [a] r ds(on) [m ? ] 25 c 150 c 0 40 80 120 160 02468 v gs [v] i d [a] 0 40 80 120 160 0 20 40 60 80 100 120 i d [a] g fs [s] 4.5 v 5 v 5.5 v 6 v 7 v 10 v 0 40 80 120 160 012345 v ds [v] i d [a] rev. 1.05 page 5 2009-11-03
bsc079n10ns g 9 drain-source on-state resistance 10 typ. gate threshold voltage r ds(on) =f( t j ); i d =50 a; v gs =10 v v gs(th) =f( t j ); v gs = v ds parameter: i d 11 typ. capacitances 12 forward characteristics of reverse diode c =f( v ds ); v gs =0 v; f =1 mhz i f =f( v sd ) parameter: t j typ 98 % 0 5 10 15 20 -60 -20 20 60 100 140 180 t j [c] r ds(on) [m ? ] 110 a 1100 a 0 0.5 1 1.5 2 2.5 3 3.5 4 -60 -20 20 60 100 140 180 t j [c] v gs(th) [v] ciss coss crss 10 4 10 3 10 2 10 1 10 0 0 20406080 v ds [v] c [pf] 25 c 150 c 25 c, 98% 150 c, 98% 1 10 100 1000 0 0.5 1 1.5 2 v sd [v] i f [a] rev. 1.05 page 6 2009-11-03
bsc079n10ns g 13 avalanche characteristics 14 typ. gate charge i as =f( t av ); r gs =25 ? v gs =f( q gate ); i d =50 a pulsed parameter: t j(start) parameter: v dd 15 drain-source breakdown voltage 16 gate charge waveforms v br(dss) =f( t j ); i d =1 ma 20 v 50 v 80 v 0 2 4 6 8 10 0 20406080 q gate [nc] v gs [v] 90 95 100 105 110 -60 -20 20 60 100 140 180 t j [c] v br(dss) [v] v gs q gate v gs(th) q g(th) q gs q gd q sw q g 25 c 100 c 125 c 1 10 100 1 10 100 1000 t av [s] i as [a] rev. 1.05 page 7 2009-11-03
bsc079n10ns g package outline: pg-tdson-8 rev. 1.05 page 8 2009-11-03
bsc079n10ns g dimensions in mm rev. 1.05 page 9 2009-11-03
bsc079n10ns g published by infineon technologies ag 81726 munich, germany ? 2008 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be reg arded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the appli cation of the device, infineon technologies hereby disclaims any and all warranties a nd liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and condi tions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon t echnologies office. infineon technologies components may be used in life-support de vices or systems only with the express written approval of infineon technologies, if a fai lure of such components can reasonably be expected to cause the failure of that life-suppor t device or system or to affect the safety or effectiveness of that device or system. life supp ort devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to as sume that the health of the user or other persons may be endangered. rev. 1.05 page 10 2009-11-03
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